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Design of a Thermal Contact Liquid Cooling System for Military Server Electronics

dc.contributor.authorCherom Kheirabadi, Ali
dc.contributor.copyright-releaseNot Applicableen_US
dc.contributor.degreeMaster of Applied Scienceen_US
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.contributor.ethics-approvalNot Applicableen_US
dc.contributor.external-examinern/aen_US
dc.contributor.graduate-coordinatorDr. Dominic Groulxen_US
dc.contributor.manuscriptsNot Applicableen_US
dc.contributor.thesis-readerDr. Robert Baueren_US
dc.contributor.thesis-readerDr. Kamal El-Sankaryen_US
dc.contributor.thesis-supervisorDr. Dominic Groulxen_US
dc.date.accessioned2016-12-14T18:40:17Z
dc.date.available2016-12-14T18:40:17Z
dc.date.defence2016-11-28
dc.date.issued2016-12-14T18:40:17Z
dc.description.abstractThe objective of this project was to design and experimentally evaluate a thermal contact liquid cooling system for military applications. The proposed system replaces fluidic connectors found in conventional water cooling systems with a thermal contact heat exchanger. This approach enhances reliability by eliminating leakage risks; however, it also undermines thermal performance by adding thermally resistive heat transfer interfaces. Experiments were conducted to quantify the downgraded thermal performance and to establish whether it is a viable trade-off for enhanced reliability. An experimental setup was constructed in order to simulate heat generation by a single processor. Results showed that the proposed system requires inlet water as warm as 53.2 ºC at a maximum heat load of 300 W. For comparison, it was also shown that a conventional water cooling system would incur refrigeration cost savings of 30 % relative to the proposed system at ambient temperatures sufficiently higher than 50 ºC.en_US
dc.identifier.urihttp://hdl.handle.net/10222/72579
dc.language.isoen_USen_US
dc.subjectHeat Transferen_US
dc.subjectMicrochannel Heatsinken_US
dc.subjectMilitary Electronicsen_US
dc.subjectElectronics Coolingen_US
dc.subjectElectronic apparatus and appliances--Cooling
dc.subjectHeat--Transmission.
dc.titleDesign of a Thermal Contact Liquid Cooling System for Military Server Electronicsen_US

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