Browsing by Subject "Isothermal Solidification"
Now showing items 1-2 of 2
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Development of a Novel Boron free Filler Metal for Transient Liquid Phase Bonding of Ni base superalloys
(2019-12-05)Joining of Ni base superalloys by transient liquid phase bonding (TLPB) has found limited application in aerospace due to the formation of brittle borides adjacent to the joint. Filler metals containing ~3 wt% B as a melting ... -
EXAMINING THE MECHANISMS AND KINETICS OF TRANSIENT LIQUID PHASE BONDING OF TITANIUM ALLOYS USING COPPER AND NICKEL FILLER METALS
(2019-11-05)Copper and nickel were examined as potential interlayers in transient liquid phase brazing (TLPB) of commercially pure titanium (CP-Ti) and Ti-6Al-4V. Experimental parameters were set such that the braze temperature was ...